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NT Series Pressure Sensor Core
NT series pressure sensor core adopts leading technology which uses two pieces of MEMS silicon wafers for challenging measuring requirements and general industrial applications in the mid and high pressure ranges. Its manufacturing process is to bond the PCB board on the diaphragm surface of the sensor after the integrated pressure diaphragm is packaged. Subsequently, the bonding process is used to connect the two pieces of MEMS silicon wafers to the PCB board, so that it can output the signal.
